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Semiconductor Wafers | Your Ultimate Wafer Glossary

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Wafers are everywhere. They are in your smartphone, your computer, your tablet, your car, and even your air conditioning. In fact, nearly all of the electronic equipment around us uses semiconductor wafers. However, despite its prevalence and the major role that plays in our daily lives, there’s a lot of things about wafers that people don’t understand. Specifically, the common wafer terminology. But don’t worry, we are here to help. Keep reading to learn the meaning of some of the most common semiconductor wafer terms. Common Wafer Terminology  Clean Room: An enclosed and extremely clean space that is necessary to manufacture semiconductor wafers. Dicing: The process of cutting a semiconductor wafer into single chips, with each containing its own complete semiconductor device. Doping: The process of adding specific impurities to a semiconductor in order to control its electrical resistivity. Polishing: The process that is applied to semiconductor wafers to either reduce its surface roughness or to remove excess material from the surface. Semiconductor: A material that only partly conducts current. Specifically, the conductivity of a semiconductor is between that of an insulator, which has practically no conductivity, and a conductor, which has almost full conductivity. Most semiconductors are crystals made of certain materials, such as silicon. Wafer: A thin, circular slice of semiconductor material that is used to fabricate integrated circuits for electronic devices and advanced technologies. Semiconductor wafers are formed by slicing, lapping, polishing, and cleaning a semiconducting material. Get Semiconductor Wafers Today! Now that you know the lingo, it’s time to get semiconductor wafers for your next project. For the best wafers, look no further than Wafer World, Inc. Founded in 1997, we are a certified manufacturing facility for silicon, gallium arsenide, germanium, indium phosphide, sapphire, and quartz wafers. View all of our semiconductor wafers and products by visiting our fully equipped online store today.

Thin Silicon Wafers | How Are Wafers Diced?

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Thanks to the rise of power semiconductor ICs for automotive applications as well as a boom in artificial intelligence and MEMS for sensor based applications in environments with high stress or extreme accuracy, thin silicon wafers are taking over the semiconductor industry. In fact, companies both old and new to the silicon wafer game are asking for thinner wafers. But how are wafers able to be diced to thin? There actually are three options: mechanical dicing, laser dicing, and plasma dicing. Keep reading to learn more. Mechanical Dicing  An initial issue with using mechanical dicing of thinner wafers was that the wafers suffered greatly from backside chipping if they were diced just like a traditional wafer. Luckily, there is now equipment and processes that specifically address the challenges of mechanically dicing thin wafers so that they can be diced with minimal backside chipping. Laser Dicing The process of laser dicing was developed to address many of the unique challenges, such as cracks and chips, that come from dicing thin silicon wafers. Laser dicing allows for many variables, or levels, to control and get the desired effect that is not possible with mechanical dicing. Plasma Dicing Plasma dicing is the third, and final, option for dicing thin wafers. This form of dicing reduces the challenges of mechanical dicing, such as vibration, as well as the challenges of heat that occur with laser dicing. Furthermore, plasma dicing has additional benefits as well, such as unique geometries to reduce stress on chips. Where Can I Get Thin Silicon Wafers? If you are looking for the highest quality of thin silicon wafers that are diced effectively, look no further than Wafer World, Inc. Since its founding by CEO and President Sean Quinn in 1997, Wafer World has been satisfying customers across six continents in over 45 countries. Visit our fully equipped online store to order your thin silicon wafers today!

Silicon Wafer | Is the Wafer Market Expected to Grow?

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A silicon wafer is an essential part of all kinds of electronic devices that enrich our lives. From smartphones to air conditioners and everything in between, silicon wafers help us every day in more ways than you may even imagine due to their flexible and small size, high reliability, low weight, and low power consumption. As a result, it should come as no surprise that the market for silicon wafers is expected to experience a massive growth by 2022. Keep reading to find out more. Silicon Wafer Market Outlook Summary Market Research Future has recently published a research report on “Global Silicon Wafers Market Research Report – Forecast to 2022.” This report provides both the newest industry data and predicts industry future trends on the world’s semiconductor silicon wafer industry, focusing on key regions (United States, Europe, China, Japan, India, and South East Asia) and dominate countries (United States, Germany, Japan, and China). Thanks to the technological development and advancement in the wafer technology used in the electronic industry as well as the growing demand for solar energy, this latest report announced that the global silicon wafers market is growing at a rapid pace. In fact, the global silicon wafers market is expected to grow at a compound annual growth rate (CAGR) of 8.5% and is estimated to reach a market size of around $503 million by 2022, which is massive compared to the already large global silicon wafers market size of $333 million in 2016. The silicon wafer market outlook helps prove that silicon wafers play a major role in our ever-expanding technological world. If you are interested in getting the highest quality silicon wafers for your next project, look no further than Wafer World. Visit our fully secure online store, which is open 24 hours a day,  or contact us today to learn more.
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