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Float Zone Silicon Wafers | What Are Their Key Features?

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Float zone wafers are products that are created using silicon crystals that were grown by the float zone method, which was based on a principle that was invented in 1962. You may not know this, but float zone wafers are everywhere. With efficiencies near 25%, float zone wafers are the high purity alternative to wafers that use silicon grown by the Czochralski (CZ) method. In addition to being extremely pure, float zone wafers possess a wide-range of key features that make them an attractive choice for numerous different applications. What are these key features? Keep reading to find out! 5 Key Features of Float Zone Silicon Wafers Feature #1: Large bulk target resistivity range.  Feature #2: Low resistivity tolerances and record low radial resistivity variations. Feature #3: Built-in control of defect levels with no D-defects (flow pattern defects) and no BMDs (bulk micro defects). Feature #4: Tolerant towards device processing. Feature #5: High minority carrier lifetimes with a low radial variation of the bulk lifetime.  Due to these key features, float zone silicon makes the perfect silicon wafers for a wide-range of applications. For example, float zone silicon wafers play an integral role in high-efficiency solar panels, power devices, detector, and optical applications. Are you interested in using float zone silicon wafers for your next project? If you answered yes, then you should contact us here at Wafer World, Inc. As leaders in silicon wafer manufacturing, we have been satisfying customers across six continents in over 45 countries and would love to satisfy you by providing you with the highest quality float zone wafers. Order silicon wafers that meet your specific needs by utilizing our fully equipped online store that is open every day, all day, with a short lead time in a secure virtual environment. Connect with us online to learn more today!

Float Zone Wafer Supplier | What Is the Float Zone Method?

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When it comes to growing silicon crystals for silicon wafers, typically either the Czochralski (CZ) or the Float Zone (FZ) method is used. With the CZ method, highly pure silicon is melted done in a crucible. A seed crystal is then mounted on a rod and dipped into the molten silicon. Next, the rod is simultaneously rotated and pulled upward, resulting is a large, single-crystal, cylindrical silicon ingot. Despite the fact that the vast majority of silicon is commercially grown through the CZ method, this technique does have some pitfalls. For example, CZ silicon wafers contain a lot of oxygen impurities that reduce the semiconductor’s voltage, current, and efficiency. Furthermore, these wafers are sensitive to high-temperature processing. That’s where the float zone technique comes. Wafers that use silicon grown by the float zone method can overcome these challenges and meet your silicon wafer needs. What is the float zone method? Keep reading for an answer straight from a reputable float zone wafer supplier. The Float Zone Method The float zone method is the go-to technique whenever a wafer requires high-purity silicon with little impurities. The basic feature of this growth technique is that the molten part of the sample is supported by the solid part. This eliminates the need for a crucible and lowers the odds of contamination. Instead, a rod of very pure polycrystalline material is held by a chuck while a metal coil is driven by a high power radio frequency signal is slowly passed along the length. The molten silicon at the seed end then starts to freeze, taking on the same crystal orientation as the seed crystal. After the heating coils move over the entire polysilicon rod, it is officially converted into a single crystal silicon ingot. Contact Our Float Zone Wafer Supplier to Learn More! Learn more and get float zone silicon wafers for your next project from the best float zone wafer supplier by contacting Wafer World, Inc. today!

Float Zone Wafers | 5 Facts You Need to Know

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Silicon is one of the most abundant solid elements on planet earth. In fact, the earth’s crust is 25% silicon. Despite this, virtually all of this element exists as compounds. Silicon is rarely found in elemental form. As a result, in order to obtain the monocrystalline silicon that is necessary to build silicon wafers, silicon needs to be produced. One of the most popular growth techniques that are used to produce silicon for wafers is the float zone (FZ) technique. The silicon that is produced by this technique is used to create float zone wafers. Do you want to learn more about float zone wafers? Then keep reading for some super interesting facts. 5 Interesting Facts About Float Zone Wafers Fact #1: The float zone process was developed at Bell Labs by Henry Theuerer in 1952. Fact #2: Float zone silicon is the highly pure alternative to silicon crystals grown by the Czochralski process.  Fact #3: Float zone wafers are commonly used to manufacture discrete power devices, high-efficiency solar products, RF chips, and optical products. Fact #4: The purity of float zone silicon allows it to go through a lighter doping process, which sometimes produces resistivity measurements of up to 50,00 ohm-com. Fact #5: The concentrations of light impurities, such as oxygen and carbon, are extremely low in float zone silicon wafers. Here’s another fascinating fact: you can get the best float zone wafers for your next project at Wafer World, Inc. Wafer World was founded in 1977 by CEO and President Sean Quinn and has been satisfying customers across the world ever since. Get the highest quality float zone wafers today by utilizing our fully equipped online store that grants you the ability to order 24 hours a day, 7 days a week. Contact us today to learn more!
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