Our team primarily uses the Czochralski method for growing silicon ingots. This technique uses a single seed crystal rotated in a high-temperature crucible filled with molten silicon. The seed crystal grows as it’s spun, and the final result is a purified ingot of silicon that can be used to make wafers.
Polishing is crucial to optimize the function of a semiconductor wafer. We use specialized polishing pads and a diamond liquid slurry while the wafer slice is held in place by a vacuum carrier. We offer single or two side polishing services.
Etching, lapping, and backgrinding are essential steps in fabrication. Etching requires chemically removing layers from a wafer's surface to remove minor deformities and anomalies for a consistent exterior. Lapping is done with polishing pads to create a flat surface. Backgrinding allows us to remove microscopic layers to create ultra-thin wafers.
Depositions of oxide and nitride are used to enhance and thicken the surface of a wafer. This is necessary to optimize a wafer’s function for certain applications, specifically in the manufacturing of photonic devices.
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