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Stay up-to-date with the latest news and trends in wafer and semiconductor technologies.
*Blogs are for educational and informational purposes ONLY
If you’re considering utilizing an InP wafer in your project, it’s important to first understand this material’s thermal properties, benefits, and challenges.
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If you’re researching substrates, ultra flat wafers can be a key element to study around, and here are some reasons why.
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If costs are a concern for your project, you can consider using InP reclaim wafers instead of virgin ones. Here’s a breakdown of these wafer’s properties.
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During silicon wafer processing, etching plays a crucial role, especially for making transistors, ICs, and other electronic components. But, what does etching really achieve?
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In the past few years, silicon wafer manufacturers have explored wafer dicing techniques to prevent chipping and wafer damage. Here are two new popular techniques.
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Thanks to advances in development methods, GaAs-powered devices have grown, potentially replacing thin silicon wafers. But, how probable is this shift?
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Laser marking can seem like the least important step of the wafer manufacturing process, but skipping it can have several risks.
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A GaAs wafer has a direct bandgap and a more efficient ability to convert electrical energy into light, which is why they’re ideal for manufacturing LEDs.
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If you’re manufacturing high-density memory arrays like DRAM and flash memory, a SI wafer is the go-to substrate.
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During silicon manufacturing, dicing is a key process to cut substrate material into individual dies. Here are some common challenges fabs face during this step.
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