Silicon wafers on manufacturing machine before packing.

Blogs

Stay up-to-date with the latest news and trends in wafer and semiconductor technologies.

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Making a Float Zone Wafer

How Float Zone Silicon Wafers React to Terahertz Radiation

August 18, 2025
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Understanding how a float zone wafer reacts to THz radiation is essential for optimizing THz optics and detection devices.

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Single Side vs. Double Side Polish Wafer

Understanding the Uses of DSP Wafers: When Single-Side Polishing Is Enough

August 11, 2025
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A double side polish wafer offers several benefits, from high precision to enhanced flatness—but when are these advantages unnecessary?

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Packing GaAs Wafers

Packing GaAs Wafers: Requirements and Complications

August 4, 2025
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Understanding the challenges and ideal packing methods when transporting GaAs reclaim wafers is key to preventing damage.

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Manufacturing a Float Zone Wafer

What Is Thermal Cycling and How Does It Impact Semiconductors?

July 31, 2025
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Different materials have different thermal cycles, from CZ silicon and GaAs to a float zone wafer. Understanding that is key when manufacturing semiconductors.

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Silicon Wafer for 3D ICs

Wafer-To-Wafer Bonding: Uses and Difficulties for the Future of Semiconductor Manufacturing

July 30, 2025
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When manufacturing complex substrates with a silicon wafer, the wafer-to-wafer bonding technique is crucial—but what does this method involve?

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InP Reclaim Wafers

When the Reclaim Process Isn't Viable: Signs an InP Wafer no Longer Can Be Reclaimed

July 23, 2025
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Before manufacturing InP reclaim wafers, fabs analyze each substrate in detail to ensure its high quality. Here are some signs we look out for.

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Thin Silicon Wafers

Czochralski Method for Ultra-Thin Wafers

July 21, 2025
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The process for making thin silicon wafers often starts with CZ silicon growth, which produces high-purity silicon with a monocrystalline structure.

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Ablation Laser Marking

What Is Ablation? Understand the Ins and Outs of Laser Marking

July 16, 2025
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Ablation is a wafer laser marking technique used to remove material from the substrate and leave a readable mark. Here, we’ll explain when this method is preferred.

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Challenges of InP Wafer Manufacturing

Common Challenges When Manufacturing InP Wafer

July 14, 2025
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InP wafers are widely used in high-speed electronics, optical communication, and photonic devices, but they are more complex to process than silicon, and here are five reasons why.

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MEMs Made with a Double Side Polish Wafer

Double Side Polishing and Chips: When Is This Step Necessary?

July 11, 2025
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Double side polishing ensures precision and consistency in semiconductors. But, for what chips and transistors rely on a double side polish wafer to function?

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