During silicon wafer processing, etching plays a crucial role, especially for making transistors, ICs, and other electronic components. But, what does etching really achieve?
Read MoreIn the past few years, silicon wafer manufacturers have explored wafer dicing techniques to prevent chipping and wafer damage. Here are two new popular techniques.
Read MoreThanks to advances in development methods, GaAs-powered devices have grown, potentially replacing thin silicon wafers. But, how probable is this shift?
Read MoreLaser marking can seem like the least important step of the wafer manufacturing process, but skipping it can have several risks.
Read MoreA GaAs wafer has a direct bandgap and a more efficient ability to convert electrical energy into light, which is why they’re ideal for manufacturing LEDs.
Read MoreIf you’re manufacturing high-density memory arrays like DRAM and flash memory, a SI wafer is the go-to substrate.
Read MoreDuring silicon manufacturing, dicing is a key process to cut substrate material into individual dies. Here are some common challenges fabs face during this step.
Read MoreWhen manufacturing CMOS, you must first buy a silicon wafer to use as a base. Here, we’ll explain the process for designing these types of sensors.
Read MoreAmong a germanium wafer’s unique properties, their thermal conductivity plays a big role in device performance. Here, we’ll explain them in detail.
Read MoreWhen manufacturing ultra flat wafers, doping them can be one of the hardest steps. Here, we’ll explore some of the common challenges of this process.
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