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Stay up-to-date with the latest news and trends in wafer and semiconductor technologies.
*Blogs are for educational and informational purposes ONLY
During silicon wafer processing, etching plays a crucial role, especially for making transistors, ICs, and other electronic components. But, what does etching really achieve?
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In the past few years, silicon wafer manufacturers have explored wafer dicing techniques to prevent chipping and wafer damage. Here are two new popular techniques.
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Thanks to advances in development methods, GaAs-powered devices have grown, potentially replacing thin silicon wafers. But, how probable is this shift?
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Laser marking can seem like the least important step of the wafer manufacturing process, but skipping it can have several risks.
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A GaAs wafer has a direct bandgap and a more efficient ability to convert electrical energy into light, which is why they’re ideal for manufacturing LEDs.
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If you’re manufacturing high-density memory arrays like DRAM and flash memory, a SI wafer is the go-to substrate.
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During silicon manufacturing, dicing is a key process to cut substrate material into individual dies. Here are some common challenges fabs face during this step.
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When manufacturing CMOS, you must first buy a silicon wafer to use as a base. Here, we’ll explain the process for designing these types of sensors.
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Among a germanium wafer’s unique properties, their thermal conductivity plays a big role in device performance. Here, we’ll explain them in detail.
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When manufacturing ultra flat wafers, doping them can be one of the hardest steps. Here, we’ll explore some of the common challenges of this process.
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