Before manufacturing InP reclaim wafers, fabs analyze each substrate in detail to ensure its high quality. Here are some signs we look out for.
Read MoreThe process for making thin silicon wafers often starts with CZ silicon growth, which produces high-purity silicon with a monocrystalline structure.
Read MoreAblation is a wafer laser marking technique used to remove material from the substrate and leave a readable mark. Here, we’ll explain when this method is preferred.
Read MoreInP wafers are widely used in high-speed electronics, optical communication, and photonic devices, but they are more complex to process than silicon, and here are five reasons why.
Read MoreDouble side polishing ensures precision and consistency in semiconductors. But, for what chips and transistors rely on a double side polish wafer to function?
Read MoreIf you’re conducting semiconductor device or material research, you may need an FZ wafer, and here’s why.
Read MoreSilicon prices have always fluctuated, and as conflict in the Middle East threatens to increase oil prices, we wonder if this will impact silicon, too.
Read MoreBefore manufacturing GaAs reclaim wafers, it’s important to understand whether or not the semiconductor can go through the reclaim process. Here are some of them.
Read MoreWafer World supports PBSC with $40K in scholarships. They're advancing education and silicon wafer manufacturing in Florida.
Read MoreIf you’re considering utilizing an InP wafer in your project, it’s important to first understand this material’s thermal properties, benefits, and challenges.
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