Die preparation is a process that involves the singulation of wafers into individual dies in preparation for silicon wafer assembly. This step has two major parts: wafer mounting and wafer sawing. So here’s everything you need to know about the die preparation process.
The first step of the die preparation process is the wafer mounting. This step is necessary because it provides support to a silicon wafer to aid its processing. During this process, the silicon wafer together with a wafer frame is secured on a wafer film or dicing tape.The wafer frame must be made from materials that are resistant to heat, warping, bending, and corrosion. The wafer film or dicing tape is a PVC sheet with fabricated adhesive on one side to support both the wafer and the frame.
Wafer mounting uses a special machine to carry out the following steps:
To preserve the quality of the silicon wafers during wafer mounting, wafer cracking, breakage, scratching, bubble trapping, and tape wrinkles must be prevented.
After the wafer mounting process, the next step is wafer sawing. This process aims to cut wafers into single dies to prepare them for assembly in IC packages. The wafer sawing consists of the following steps:
The die preparation process is an important part of wafer assembly and packaging. To learn more about the die process and the manufacturing of silicon wafers, contact us today for more information!