An FZ wafer is produced through the float zone method, which is a high-purity alternative to the traditional CZ process. Several wafer manufacturers employ this method because of the advantages it offers. If you’re considering using FZ wafers for your business or next project, knowing more about it may help you get the most use out of it. Here are the facts you need to know about FZ wafers:
Float zone method is a modification of a method developed by William Gardner Pfann for germanium. It was in the year 1995 when Henry Theurer further developed it and utilized the vertical zone melting process to obtain a highly pure FZ wafer. Vertical zone melting refers to a group of identical methods of purifying crystals.
An FZ wafer has extremely low concentration levels of light impurities, minimal micro defects, improved mechanical strength, and a high growth rate, which makes it suitable for high power, high temperature, and high-frequency applications. Because of these superior qualities, FZ wafers are highly efficient.
The manufacturing of FZ wafers compared to wafers produced through the CZ process is relatively cheaper and faster.
FZ wafers are widely used in the production of power devices, detector applications, optical applications, solar cells, electric appliances, solar arrays of satellites, chips and more.
Because of surface tension limitations during growth, the diameter of an FZ wafer is not greater than 200 mm.
If you’re looking for a high-quality FZ wafer at a reasonable price, then you can get them at Wafer World! We are dedicated to providing high-quality wafers to all our clients worldwide. For inquiries, contact us or visit our website to purchase wafers online!