InP Wafer | Indium Phosphide Wafer Process


June 6, 2018

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Indium phosphide (InP) is a binary semiconductor composed of indium and phosphorus. It has a face-centered cubic crystal structure, identical to that of GaAs and most of the III-V semiconductors. It can be found in many different types of electronics. Let’s take a deeper look at what exactly an InP wafer is and how it is processed.

What is Indium Phosphide?

As we touched on in the introduction, Indium Phosphide is a semiconductor made of indium and phosphorus. It is used in high power and high-frequency electronics and has a high electron velocity. In fact, the electron velocity of InP is significantly higher than other more common semiconductors such as Silicon and Gallium Arsenide. It is also found in opto-electronic devices such as laser diodes.

What is the InP Process?

InP wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

Are You Looking for an InP Wafer?

At Wafer World, we are your go-to place for everything wafers, including InP wafers. After all, we have been doing it for over 20 years! Contact us today to learn more about the wafers that we offer and how we can help you with your next project.

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