Silicon wafer processing is an intricate process that consists of creating thin, flat discs that will serve as the base for creating microchips and integrated circuits. These elements will then power electronic devices, serving as the base of our society’s technology.
Still, wafer processing involves several steps and various raw materials, some of which can be toxic if handled without proper care. Here, we'll explore some of those risks, explaining how fabs avoid them and ensure a safe environment for their workforce.
The process needed to create silicon wafers, which will then be used as semiconductors in various industries, is a complex affair that involves multiple steps.
These processes often involve high temperatures, chemicals, and complex machinery, which can pose safety risks for workers if not properly managed. Some of the potential dangers of wafer processing are:
Several chemicals are used in the cleaning, etching, and deposition phases of wafer processing. These substances frequently contain gases, bases, acids, and solvents that, if handled improperly, can be dangerous for humans. For instance, wafers are frequently cleaned and etched using strong acids such as hydrofluoric, sulfuric, and hydrochloric acid.
Inhaling these substances can result in serious burns, respiratory problems, and even long-term health issues like lung damage. Furthermore, some chemicals can release harmful fumes that can cause skin and eye irritation or chemical poisoning.
Wafer fabs protect their employees by installing appropriate ventilation systems, like fume hoods. Personal protective equipment (PPE) like goggles, gloves, and chemical-resistant aprons is also provided.
Furthermore, wafer processing facilities usually have stringent safety procedures in place to reduce the risks of chemical exposure. This entails routine training, labeling, chemical inventory monitoring, and instruction in emergency procedures for handling mishaps.
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During wafer processing, high-temperature furnaces for thermal oxidation and deposition processes, as well as various machines that operate with electricity, are used. The high temperatures used in processes such as chemical vapor deposition (CVD) and plasma etching can pose serious burn risks to workers.
Electrical hazards are also present due to the complexity of machinery and the need to handle high-voltage equipment. Accidents can occur when machinery fails or workers are not trained to work near high-voltage systems.
If safety precautions are not properly followed when handling equipment or when electrical components are not properly grounded, electrocution or serious burns could result.
Wafer fabrication facilities employ a variety of engineering controls, including temperature sensors, automated shut-off mechanisms, and insulated equipment, to reduce these risks.
Regular maintenance is necessary to keep all electrical components in good operating order. Employees must wear insulated shoes, fire-resistant clothes, and heat-resistant gloves.
Accident prevention also depends on regular safety training and the development of precise protocols for handling high-temperature and high-voltage equipment. The probability of a dangerous incident is lowered by ensuring all employees are aware of these risks and adhere to the safety procedures.
Wafer processing in semiconductor manufacturing needs to be done in a controlled setting to avoid contamination from dust, particulate matter, or flying debris.
Even microscopic contaminants can have a significant effect on a wafer's delicate microstructures. Particulate contamination can result in expensive recalls or waste, as well as flaws in the finished product that make it unusable. More importantly, workers could be at risk for health problems from these particulates, particularly if they inhale them for extended periods.
Upon contact, fine dust from the wafer materials—such as silicon or metals—may irritate the eyes and respiratory tract or result in skin rashes. Long-term exposure to particulate matter without appropriate respiratory protection can also cause workers to develop chronic lung conditions like pneumoconiosis.
Wafer processing facilities usually employ cleanroom settings, which are carefully maintained to reduce particulate contamination and alleviate these worries.
These cleanrooms are equipped with airlock systems to regulate airflow, high-efficiency particulate air (HEPA) filters, and stringent gowning and hygiene procedures. To protect themselves from breathing in dangerous particles and to avoid contaminating the environment, workers must wear PPE such as face masks, gloves, and cleanroom suits.
Furthermore, routine particle monitoring and air quality testing are common procedures to guarantee that the cleanroom environment is kept free of contaminants. Maintaining the integrity of the workspace and halting the spread of contaminants are made possible by appropriate waste management and routine cleaning practices.
Silicon wafers are fragile and delicate materials, prone to breaking or shattering if not handled carefully and precisely in the wafer processing environment. If not, the broken wafers can result in cuts or injuries.
Processing-related equipment like wafer handlers, robotic arms, and cutting tools can also cause physical harm if not properly maintained or operated. When operating machinery or handling tools and materials by hand, employees in semiconductor plants run the risk of suffering laceration, crushing, or pinching injuries.
Additionally, if safety precautions are not taken or if workers unintentionally come into contact with moving parts, high-speed machinery can seriously injure them.
Workers receive thorough training on safe wafer handling and machine operation as preventive measures to reduce physical harm.
Facilities must install safety features like guards, emergency shut-offs, and equipment interlocks to keep employees away from potentially dangerous moving parts. Workers should minimize injuries from mishandled equipment or accidental drops by wearing the proper PPE, such as gloves and safety glasses.
Routine safety checks, risk assessments, and the enforcement of standard operating procedures are essential for maintaining a safe working environment and reducing the risk of injury in wafer processing plants.
Silicon wafer processing is not a dangerous practice: wafer fabs are highly advanced companies where every environment is perfectly regulated to guarantee both semiconductor cleanliness and worker safety. And as the manufacturing process continues to specialize, security requirements are only expected to grow.
Nevertheless, as wafer manufacturers face the risk of experiencing a worker shortage in the future, sharing the inside of fabs is our responsibility. If you’d like to learn more about work style and security measures ensured at Wafer World, contact us today for more information!
