Silicon chips have become a standard part of the tech and electronic community. They are everywhere now. They can be found in pretty much every type of smartphone, tablet, computer, and even in automobiles. Let’s take a look at the process that goes into silicon wafer manufacturing and the making of a silicon chip.
Silicon chips are specifically designed for what they are being inserted into. Design specifications include the size of the chip, the number of transistors, testing, and production. These specifications are then used to create schematics. Designers then use computer-aided design workstations to perform comprehensive simulations and tests of the chip functions.
Making chips is a complex process requiring hundreds of precisely controlled steps that result in patterned layers of various materials built one on top of another. A photolithographic "printing" process is then used to form a chip’s multilayered transistors and interconnects on a wafer. After the layers are completed, a computer then performs a process called wafer sort test. This test ensures that the chips perform how they are supposed to.
After the fabrication and subsequent testing, the packaging of the chips then takes place. The wafer is cut into individual pieces which are called dies. The die is then packaged between a substrate and a heat spreader.
At Wafer World, we manufacture some of the highest-quality wafers available on the market. Contact us today to learn more about silicon wafers, or to place your next silicon wafer order.