To achieve a thin silicon wafer, wafers go through the different grinding removal process. But not all methods get rid of damage and boost final surface appearance the same way. In this article, we will discuss the different grinding removal processes and their advantages.
Dry plasma etching the process of removing plastic, other semiconductor material, or surface damage present on the surface of a wafer using plasma. The active ions in the plasma smash into the material and get rid of it without the help of any chemicals. This is considered to be the most environmentally friendly method available. Its advantages are the following:
Wet etching is the process of removing exterior damage. It’s also utilized to produce thin wafers and achieve a thin silicon wafer. Its advantages are the following:
This method combines polishing and grinding. What’s great about traditional loose-abrasive polishing is that it can thin a wafer while smoothening its surface. Its advantages are the following:
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