Ultra Flat Wafers | Wafer Polishing for Ultra Flat Wafers


October 14, 2019

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Wafers go through polishing to remove unwanted stresses and surface damage. It’s also carried out to help achieve ultra-flat silicon wafers and ultra-flat silicon chips, which are commonly used for critical applications and high-resolution imaging. If you’re planning to use ultra flat wafers for your next project, then you may want to know more about wafer polishing and polished wafers. Here’s what you need to know about it!

Polishing Process

Wafer polishing is a crucial step in producing high-quality, defect-free wafers. It’s also one of the processes that help achieve ultra-flat wafers by stripping off unwanted layers. The process utilizes polishing pads and diamond liquid slurry to polish the wafers. It starts by placing the wafer on a vacuum carrier to hold it in place. The backside of the wafer needs to be exposed, so make sure it’s positioned that way. After that, the wafer and carrier are carefully put against a rotating platen-covered with a polishing pad. Then, using a precise downward force, the unwanted layers and defects are carefully removed. This helps create a thinner yet stronger wafer for customers. Keeping a wafer damage-free and ultra-flat can be difficult, but not impossible.

Polished Silicon Uses

Polished silicon is a superior substrate for imaging, microfabrication applications, and experiments. It makes a great wafer or diced chips and wafer. For SEM, STM, and FIB applications, the silicon wafers and chips are doped with Boron and are all P-type to provide good conductivity. For biological applications, silicon resembles glass, which makes it an excellent support for multiplying and growing cells. It also makes an excellent sample substrate for small particles because of the reduced background signal of a highly polished surface.

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