Laser marking plays an important role in silicon manufacturing. It is the process of putting marks on semiconductor packages using a laser beam. It is considered to be an alternative to ink marking. In this article, we will discuss everything you need to know about laser marking.
Laser stands for “light amplification by stimulated emission of radiation”. This means a high-intensity beam of light is being discharged by atoms that have been supplied with high energy through the optical or electrical method. Laser marking is the last step in silicon manufacturing. It is a non-contact thermal process that changes the surface of the semiconductor package to successfully mark it using the heat coming from the laser beam.
Optical stimulation is generally used for solid, crystalline materials. It uses special lamps or diode bars to blast the crystalline material with wavelength-specific light. Electrical stimulation, on the other hand, uses a DC or RF signal to stimulate gas atoms.The electrical or optical stimulation of atoms of the laser material causes the electrons to take in all the energy and transfer to a higher energy level. After this, they start releasing photons to return to a lower energy level.
More and more silicon manufacturing companies use laser marking to efficiently mark semiconductor packages. At Wafer World, we offer high-quality wafers at a reasonable price. Contact us for inquires!