If you’re looking to find wafers that are made from the purest form of silicon slices, you should take a closer look at the float zone or FZ wafer. Since this type of wafer is made through the vertical melting zone process, its purity offers more benefits than those that are grown through the Czochralski or CZ method.
Float Zone wafers are produced based on Theurer’s zone-melting principle, which involves a process that takes place inside a passive gaseous atmosphere or a vacuum. It begins by holding monocrystalline seed crystals and a high-purity crystalline rod parallel against each other. These are rotated in a vertical position while they’re partially melted with a radiofrequency field.At the top portion of the poly rod, the seed is brought up to touch with a single drop of melt before the necking process is performed. This process results in discoloration-free crystal production before it reaches the set diameter for growth at a steady state.
Wafers created through the FZ method have a growth rate that’s two to three times higher than wafers produced through the CZ method. Thanks to these high growth rates, the defects of FZ wafers are significantly reduced.
Did you know that the presence of oxygen in silicon can harm the quality of the wafer? Since the oxygen levels of FZ wafers are considerably low, you can be sure that their quality is top-notch.
Applications that produce electronic devices make use of the bulk of the silicon wafers. Since FZ wafers feature dopant control, they’re able to control the crystal’s resistivity.
At Wafer World, we produce highly efficient wafers at the best price possible. Contact us today for inquiries!
