Double side polish wafers, also known as DSP wafers, are semiconductor wafers that have been polished on both sides to achieve an exceptionally smooth surface. Their unique properties make them ideal for advanced semiconductor applications where high precision and low surface roughness are crucial.
Moreover, DSP wafers often feature higher performance yield, and here we’ll explain why.
Polishing both sides eliminates micro-defects, scratches, and mechanical damage from previous operations (such as lapping or slicing). As a result, fewer particle adhesion sites and a lower defect density increase device yield.
DSP wafers have extremely tight total thickness variation (TTV) and wafer bow tolerances. This is crucial for processes like bonding, photolithography, and CMP (chemical mechanical planarization), where even minor changes can impair device performance and alignment.
Stress imbalances brought about by single-sided polishing may cause the wafer to warp.
Stress-balanced DSP wafers preserve planarity under mechanical and thermal loads, which is essential for wafer bonding, MEMS, and SOI.
Due to the optical flatness of both surfaces, DSP wafers minimize wavefront distortion, stray light, and back reflections in optical applications.
Therefore, they’re ideal for optical sensors, interferometry, and laser-based systems.
In advanced fabrication (e.g., MEMS, 3D ICs, wafer-level packaging), processes often need access to both sides of the wafer. DSP wafers enable precise alignment and uniform processing from either side.
Unlike one side polished wafers, double side ones are precision-polished to be extremely flat, smooth, and parallel. This has several critical advantages in high-tech applications, especially semiconductors, optics, and microfabrication.
If you’re unsure whether that’s what you need for your project, Wafer World can help. Contact us today to learn more about our products!
