To guarantee a semiconductor's accuracy and consistency, the substrates your silicon wafer supplier provides need to be incredibly flat and mirror-polished. Depending on the material type and intended use, various polishing methods can be applied, adjusting factors such as polishing force, rotation speed, and other parameters.
However, as technology advances, so does the need for precise polishing wafers. This has led to research and innovations regarding polishing techniques. Let’s go over some of them.
Without proper polishing, the devices will become misaligned and distorted, preventing them from achieving the necessary accuracy and dependability at the nanoscale. This is particularly crucial when producing ultra-small sensors with Light-Emitting Diode (LED) chips and Micro-Electrical Systems (MEMS) technology.
Silicon is well known for its remarkable hardness, thermal conductivity, chemical stability, and resistance to wear. However, it is challenging to meet the strict requirements for even corrosion during the polishing process and for surface flatness and roughness following polishing.
Developing new polishing fluids and optimizing techniques is essential to address these challenges. Fortunately, a study conducted in 2024 attempted to optimize and validate the polishing fluid composition used in Chemical Mechanical Polishing (CMP).
The study achieved notable advancements.
This allowed them to attain a material removal rate (MRR) of 25.96 nm/min. Moreover, overall surface quality was significantly improved as the surface roughness (Ra) was lowered by 57.14%. This was a considerable improvement in the polishing technique.
Qualified silicon wafer suppliers provide highly polished materials, enabling precise applications in high-tech and extreme conditions. Because of that, keeping an eye on advances in precision polishing techniques is crucial for Wafer World.
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