Silicon is the most common and popular type of element used to fabricate wafers. But it isn’t the only element you can work with. There are a few other elements used in wafer manufacturing, which have their strengths that make them more suitable for certain applications. Here are some of the basic elements used in wafer manufacturing:
Aluminum is the most plentiful metallic element on earth. It is used in many facets of wafer manufacturing, which includes the following:
Boron is a brittle but hard semi-metallic element that is utilized as a dopant in semiconductor instruments. It is identified as an acceptor when employed as a dopant for Si instruments.
Germanium is a semi-metallic element that was originally used to manufacture transistors and diodes. But due to its low bandgap, it created huge leakage currents in its reverse-biased p-n junctions.
Lead is one of the elements used in solder to finish the outside leads of an IC package.
Phosphorous is a non-metallic element utilized as a dopant in semiconductor instruments. It is identified as a donor when employed as a dopant for Si instruments.
Gallium Arsenide or GaAs is a compound element used as a substrate semiconductor for creating integrated circuits. It can function properly even at higher temperatures compared to Si devices. It is also less likely to show thermally-induced leakage and noise.
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