AS 9100 : 2009 | REV C / ISO 9001 : 2008 Certified

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addr1100 Technology Place, Suite 104
West Palm Beach, FL 33407

Services

Silicon and Semiconductor Wafer Services

  • Diameters 25.4 mm-150.0 mm
  • Growth Methods
  • Cz .001-100 ohm-cm
  • Fz 100-10,000 ohm-cm
  • Orientations (100) (111) (110)
  • Thickness 10-10,000 microns
  • MEMS 10-200 microns
  • Semi-Standard 200-1000 microns
  • Thick Slabs 1,000-10,000 microns
  • Surface one or two side polish
  • TTV < 1 micron
  • Services
  • Etching, Lapping, Backgrinding
  • Oxide and Nitride Depositions

GaAs, InP Reclaim

  • Diameters 25.4 mm-150.0 mm
  • Major cost Savings!
  • Quantities 50-1,000 per order
  • Surface one or two side polish
  • Orientations (100) (111) (110)
  • Green Technology Recycle up to 3X

Germanium

  • Diameters 25.4 mm-150.0 mm
  • Resistivity .001-50 ohm-cm
  • Orientations (100) (111) (110)
  • Thickness 100-10,000 microns
  • Surface one or two side polish
  • Reclaim service
  • EPI Solar grade quality polish

Other Materials

III-V Wafers II-VI Wafers Optic Wafers Superconductor Wafers
 InP ZnO YVO4 MgO
GaP ZnSe TiO2 YSZ
InSb CdS CaCO3 SrTiO3
InAs CdTe LiNbO3 KTaO3
These Wafers are available through our Request a Quote Form

Clean Room Packaging

  • E-pak distributor
  • Process Cassettes
  • Single wafer cassettes
  • Shipping cassettes