A double side polish wafer is useful and relevant in MEMS, semiconductors, and other applications where a specific flatness is required. They’re also necessary for device manufacturing projects and double side patterning. In this article, we will delve in a little deeper about the processes involved in producing double side polish wafers.
For wafers intended for memory chips and epi wafers in microprocessors, polishing plays an important role in achieving a mirrorlike surface and the required flatness for these types of applications. Polishing wafers also satisfy the demand for future technology generations. Here are the processes involved in producing double side polish wafer:
To polish wafers, you will need a polishing pad that contains abrasives and a polishing agent solution. Before you start polishing, you need to make sure that the solution is free of any solids while being added between the backside of the wafer and the polishing pad. The same process applies to the front side of the wafer. You need to make sure that the solution is free of any solids as it is being added between the polishing pad and the wafer’s surface.
The polishing also helps get rid of any microdamage and microroughness from both sides of the wafer. To finish off the polishing process, the front side of the wafer will be polished using a polishing pad that contains no abrasives and a polishing agent solution that contains abrasives. The same step applies to the backside of the wafer.
A double side wafer is proven to be useful in many applications, especially for applications that have a specific flatness requirement. If your next project involves the use of double side polish wafers, you can get them from Wafer World. We offer high-quality wafers at a reasonable price! Contact us for inquiries or purchase wafers online!