Float zone silicon wafers are the highly pure alternative to wafers that use silicon crystals that are grown by the Czochralski process. This type of wafer was developed at Bell Labs by Henry Theuerer in 1955 after modifying a method that was previously developed by William Gardner Pfann for germanium.
Float zone wafers are made through the float zone method. It consists of taking a silicon ingot and slowly rotating it as it’s passed through a heating element. A portion of the ingot is then partially melted as the heating element moves along the ingot. As the silicon re-solidifies, the imperfections remain in the melted portion as the heating element continues to rotate and move along the ingot. After the entire ingot passes through the heating element and dopants are added, it is cooled and sliced.
Float zone wafers can be extremely beneficial. Their most noteworthy benefit is the fact that their concentrations of light impurities, such as carbon and oxygen, are extremely low.
Float zone wafers are used for a wide-range of applications. They are most typically used for power devices and detector applications.
If you are looking for the best float zone wafers for your next project, you can get them at Wafer World, Inc. Since its establishment in 1997 by CEO Sean Quinn, Wafer World, Inc. has become a leader in FZ wafer manufacturing and serves customers in over 45 countries. Request a quote from Wafer World, Inc. for any and all of your wafer needs today!