The Different Bonding Methods Used in Semiconductor Manufacturing


June 9, 2020

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To build composite 3D structures, cavities, and closed fluid channels that are mechanically strong and can provide strong electrical contact, then it's important to bond two or more micro-components securely. Different bonding techniques can be used, depending on the bonding materials available like a silicon wafer, germanium wafer, or InP wafer. Bonding takes place at the wafer level, so it's essential to choose a technique wisely. In this article, we will discuss the different bonding methods used in semiconductor manufacturing.

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What are the Different Bonding Methods Used in Semiconductor Manufacturing?

Silicon Direct Bonding

A silicon wafer can be bonded securely through thermal action in a process called direct silicon bonding. Direct bonding means two pieces are joined together without any transitional layer or external force. The SDB is a beneficial technique, especially if you're working with silicon for medical and chemical applications.

Anodic Bonding

This bonding technique uses electrostatic force to bond two materials at lower temperatures without using any additional bonding material. The use of an anodic bonding technique to join two silicon wafers is only possible if one of the wafers has a glass layer deposited on its surface. Anodic bonding is used for biomedical applications since it utilizes biocompatible materials.

Glass Bonding

Glass creates a transparent, chemical, and temperature-steady environment for microfluidic devices. Glass bonding begins with cleaning both wafers then and adequately activating them through the piranha treatment. If there are any Newton's rings indicated after the pre-bond, it means that the wafers weren't cleaned properly, and the wafers need to be detached and cleaned again.

Plasma-Activated Bonding

Plasma-activated bonding is a technique that allows the direct bond of low-temperature surfaces. The plasma gets rid of the contaminants on the surface and creates Si-OH groups that help the surfaces become hydrophilic.

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Each bonding technique has its purpose and advantages. If you wish to bond a silicon wafer with another, use an appropriate bonding technique to achieve the best results. At Wafer World, we offer high-quality wafers at a reasonable price! Contact us for inquires or purchase online!

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