A germanium wafer is used in a variety of applications, from solar cells, infrared optics, to sensors. It possesses unique and excellent crystallographic and electric properties that make it suitable for high power and high-efficiency applications. Germanium wafers, just like any other wafers, go through several processes, including flat or notch grinding. In this article, we will discuss everything you need to know about notch grinding.
Flat or notch grinding comes in during the 2nd step. When the germanium crystal is being generated. Ge wafers bear some kind of physical evidence regarding its crystallographic orientation the dopant type it carries. The evidence is shown by precisely grinding a notched or one or two flat sections on the ingot along with a crystallographic orientation. The flat section that determines the crystallographic orientation is called the primary flat, while the second one is called the secondary flat. The crystallographic orientation of the ingot is carried out through x-ray goniometry first before the flat or notch grinding is done. After the orientation, the block of germanium is moved to the grinder and debilitated. After this, the flat or notch is reduced to the desired dimension.
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