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Stay up-to-date with the latest news and trends in wafer and semiconductor technologies.
*Blogs are for educational and informational purposes ONLY
Ablation is a wafer laser marking technique used to remove material from the substrate and leave a readable mark. Here, we’ll explain when this method is preferred.
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InP wafers are widely used in high-speed electronics, optical communication, and photonic devices, but they are more complex to process than silicon, and here are five reasons why.
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Double side polishing ensures precision and consistency in semiconductors. But, for what chips and transistors rely on a double side polish wafer to function?
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If you’re conducting semiconductor device or material research, you may need an FZ wafer, and here’s why.
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Silicon prices have always fluctuated, and as conflict in the Middle East threatens to increase oil prices, we wonder if this will impact silicon, too.
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Before manufacturing GaAs reclaim wafers, it’s important to understand whether or not the semiconductor can go through the reclaim process. Here are some of them.
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Wafer World supports PBSC with $40K in scholarships. They're advancing education and silicon wafer manufacturing in Florida.
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If you’re considering utilizing an InP wafer in your project, it’s important to first understand this material’s thermal properties, benefits, and challenges.
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If you’re researching substrates, ultra flat wafers can be a key element to study around, and here are some reasons why.
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If costs are a concern for your project, you can consider using InP reclaim wafers instead of virgin ones. Here’s a breakdown of these wafer’s properties.
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