A double side polish wafer is commonly used in MEMS, semiconductors, and other applications that require specific controlled flatness. They’re also necessary for device manufacturing projects and double side patterning. The demand for double side polish wafers has also increased as the demand for smaller and thinner semiconductor devices increased. But how do wafer manufacturers produce extremely flat wafers? Read on to know more about double side polishing.
Various methods are used to improve the flatness of wafers, but today, we’re going to discuss specifically double side polishing. Double side polishing is one of the many methods used to flatten and improve the surface contamination levels of wafers. It involves simultaneously polishing both sides of the wafer, or by polishing each side at a time, which results in losing extrinsic gettering capabilities. Extrinsic gettering capability refers to the process of removing device-degrading impurities but uses external means to produce stress in the wafer in a way that protracted defects required for capturing impurities are produced.
Partial back polishing is also performed to help get rid of surface roughness and damage, but doing so compromises some of the advantages associated with double side polishing. Some wafer manufacturers prefer to polish their wafers on both sides, producing a double side polish wafer that has a polished mirror finish on both sides. The polished surface prevents particle trapping, which means that little to no extrinsic gettering is possible. Double side polishing results in excellent surface finish, improved surface quality, reduced stress on the material, reduced surface roughness, improved parallelism.
A double side polish wafer might be the type of wafer you need for your next project! At Wafer World, we offer high-quality double side polished wafers at the best price possible. Contact us for inquiries!