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Stay up-to-date with the latest news and trends in wafer and semiconductor technologies.
*Blogs are for educational and informational purposes ONLY
Bonding substrates from silicon wafer suppliers can produce more effective, durable, and comprehensive chips. Here are some bonding techniques worth knowing about.
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Behind the spurt of more realistic AI generators lies the growth in wafer manufacturing. Here, we’ll explain the role of wafers in AI images.
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Understanding the challenges and ideal packing methods when transporting GaAs reclaim wafers is key to preventing damage.
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Different materials have different thermal cycles, from CZ silicon and GaAs to a float zone wafer. Understanding that is key when manufacturing semiconductors.
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When manufacturing complex substrates with a silicon wafer, the wafer-to-wafer bonding technique is crucial—but what does this method involve?
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Before manufacturing InP reclaim wafers, fabs analyze each substrate in detail to ensure its high quality. Here are some signs we look out for.
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The process for making thin silicon wafers often starts with CZ silicon growth, which produces high-purity silicon with a monocrystalline structure.
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Ablation is a wafer laser marking technique used to remove material from the substrate and leave a readable mark. Here, we’ll explain when this method is preferred.
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InP wafers are widely used in high-speed electronics, optical communication, and photonic devices, but they are more complex to process than silicon, and here are five reasons why.
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Double side polishing ensures precision and consistency in semiconductors. But, for what chips and transistors rely on a double side polish wafer to function?
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